Polyimide Foil Flip-Chip Direct Bonding

Deckert, Martin; Lippert, Michael; Krzemiñski, J.; Takagaki, Kentaroh; Ohl, Frank; Schmidt, Bertram

by Martin Deckert, Michael Lippert, J. Krzemiñski, Kentaroh Takagaki, Frank Ohl, Bertram Schmidt

Reference:

Polyimide Foil Flip-Chip Direct Bonding (Martin Deckert, Michael Lippert, J. Krzemiñski, Kentaroh Takagaki, Frank Ohl, Bertram Schmidt), In EMPC 2017 : European Microelectronics and Packaging Conference & Exhibition, 2017.

Bibtex Entry:

@inproceedings{deckert_polyimide_2017,
	address = {Warschau},
	title = {Polyimide {Foil} {Flip}-{Chip} {Direct} {Bonding}},
	booktitle = {{EMPC} 2017 : {European} {Microelectronics} and {Packaging} {Conference} \& {Exhibition}},
	author = {Deckert, Martin and Lippert, Michael and Krzemiñski, J. and Takagaki, Kentaroh and Ohl, Frank and Schmidt, Bertram},
	year = {2017}
}